GP-25 Graphite Circuit Board

Feature

  • Ultra high thermal conductivity
  • Soft and high compressibility
  • Natural tack
  • Easy to assembly
  • Natural tack
  • Easy to assembly

 

Application

LED、M/B、LCD-TV、Notebook、PC and other applications.

 

Termal Conductivity Comparison Sheet

LED Thermal Pad

Non-silicone Thermal PadThermal Pad

Property Range UNIT

Peel Strength

2.5

Kg/cm

Thickness

1.2

mm

Breakdown Voltage

2.4

KV

Solder Heat Resistance

230 (180s)

Heat Shorting

300 (80s)

Thermal Conductivity

X

400

W/mk

Y

400

Z

15

Thermal Resistance

1.6

℃ in2/W

Heat Proliferate

3.0

cm2/s

Specific Gravity

1.3

-

Graphite Contained

99.5

Density

1.5

g/cm3

Sitemap Thermal Compound Non-silicone Thermal Pad

Gap Filler