Available to apply adhesive,
pre-cut for different shape.
H48-2 Thermal Conductive Pad
Feature
- Very good thermal conductivity
- Very soft and high compressibility
- Natural tack
- Easy to assemble
- Very good insulator
Application
- Electronic components: IC、CPU、MOS
- LED、M/B、P/S、Heat Sink、LCD-TV、Notebook PC、PC、Telecom Device、Wireless Hub……etc.
- DDR II Module、DVD Applications、Hand-set applications……etc.
Thermal Impedance V.S Pressure (mouse over)
 |
 |
| Property | H48-2 | Unit | Tolerance | Test Method |
Color |
Dark Red |
- |
- |
Visual |
Thickness
(the thickness can be ordered) |
0.2~20 |
mm |
- |
ASTM D374 |
0.0078~0.7874 |
inch |
- |
ASTM D374 |
|
Thermal Conductivity |
2.2 |
W/m.k |
- |
ASTM D5470 |
Flame Rating |
V-0 |
- |
- |
UL 94 |
Dielectric Breakdown Voltage |
>5 |
kV/mm |
_ |
ASTM D149 |
Weight Loss |
<1 |
% |
- |
ASTM E595 |
Specific Gravity |
2.43 |
g/cm³ |
±0.2 |
ASTM D792 |
Working Temperature |
-40 ~ +200 |
℃ |
- |
- |
Volume Resistance |
>1011 |
Ohm-cm |
- |
ASTM D257 |
Elongation |
282 |
% |
±0.28 |
ASTM D412 |
Tensile Strength |
7 |
Kgf/cm² |
±2 |
ASTM D412 |
Standard shape |
- |
Sheet ones |
- |
- |
Hardness |
10 |
Shore A |
±2 |
ASTM D2240 |
|
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REACH Compliant