Thermal Compound Manufacturer

Available to apply adhesive,
pre-cut for different shape.

Thermal CompoundGap Filler

H48-2K Thermal Conductive Pad

Feature

  • Non-reinforement carrier
  • Low contact thermal impedance
  • Non-Oil Bleed
  • High dielectric breakdown Voltage

Application

  • Electronic components: IC、CPU、MOS
  • LED、M/B、P/S、Heat Sink、LCD-TV、Notebook PC、PC、Telecom Device、Wireless Hub……etc.
  • DDR II Module、DVD Applications、Hand-set applications……etc.

Thermal Impedance V.S Pressure (mouse over)

Thermal Paste Manufacturer Ceramic Heat Spreader
Property H48-2 Unit Test Method

Thickness(+/-10%)

0.1/ 0.2/ 0.3

mm

 

Color

Dark Red

-

Visual

Construction

Silicone Base With Ceramic Fillers
(non-silicone oil)

-

-

Op. temp. range

-45 to 200

-

Density  (g/cm3 )

2.1

g/cm³

ASTM D792

Thermal Conductivity

2.2

w/mk

ASTM D5470

Hardness Shore A

40

-

ASTM D2240

Thermal Impedance

-

-

ASTM D5470

10psi

0.21/ 0.37/ 0.57

K- in²/W

-

50psi

0.20/ 0.33/ 0.51

K- in²/W

-

100psi

0.17/ 0.31/ 0.46

K- in²/W

-

Percent deflection    

-

-

ASTM D575

10psi

2

%

-

50psi

5

%

-

100psi

11

%

-

Breakdown Voltage

1.2 / 2.5 / 3.5

KV

ASTM D149

TML

<0.5 %

%

ASTM E595

Tensile strength

200

psi

ASTM D412

Elongation

50

%

ASTM D412

UL flammability

V-0

-

UL 94

Thermal Interface MaterialREACH Compliant Non-silicone Thermal Pad Thermal Compound Thermal Interface MaterialRoHS Compliant

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