Non-silicone Thermal Pad Thermal Compound Manufacturer

Available to apply adhesive,
pre-cut for different shape.

Thermal CompoundThermal Interface Material

H48-6 Thermal Conductive Pad

Feature

  • Very good thermal conductivity
  • soft and high compressibility
  • Natural tack
  • Easy to assemble
  • Very good insulator

Application

  • Electronic components: IC、CPU、MOS
  • LED、M/B、P/S、Heat Sink、LCD-TV、Notebook PC、PC、Telecom Device、Wireless Hub……etc.
  • DDR II Module、DVD Applications、Hand-set applications……etc.

Thermal Impedance V.S Pressure (mouse over)

Ceramic Heat Spreader Non-silicone Thermal Pad
Property H48-6 Unit Tolerance Test Method

Color

Dark Gray

-

-

Visual

Thickness (the thickness can be ordered)

0.3~20

mm

-

ASTM D374

0.0118~0.787

inch

-

ASTM D374

Thermal Conductivity

3.2

W/m.k

-

ASTM D5470

Flame Rating

V-0

-

-

UL 94

Dielectric Breakdown Voltage

>5

kV/mm

_

ASTM D149

Weight Loss

<1

%

-

ASTM E595

Specific Gravity

2.42

g/cm³

±0.2

ASTM D792

Working Temperature

-40 ~ +200

-

-

Volume Resistance

>1011

Ohm-cm

-

ASTM D257

Elongation

130

%

±13

ASTM D412

Tensile Strength

8

Kgf/cm²

±2

ASTM D412

Standard shape

-

Sheet ones

-

-

Hardness

20

Shore A

±5

ASTM D2240

Thermal Adhesive TapeREACH Compliant LED Thermal PadRoHS Compliant

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