H48-6G Thermal Conductive Pad
Available to apply adhesive,
pre-cut for different shape.
Feature
- Ultra high thermal conductivity
- Soft and high compressibility
- Natural tack
- Easy to assemble
Application
- Electronic components:IC、CPU、MOS
- LED、M/B、P/S、HEAT SINK、LCD-TV、N/B PC、PC、Telecom Device、Wireless Hub…etc.
- DDR II Module、DVD Applications、Hand-set applications…etc.
Thermal Impedance V.S Pressure (mouse over)
 |
 |
| Property | H48-6G | Unit | Tolerance | Test |
Color |
Gray |
- |
- |
Visual |
Thickness
(Gap is 0.1mm, |
0.3~5.0 |
mm |
- |
ASTMD374 |
0.0118~0.1969 |
Inch |
- |
ASTM D374 |
|
Thermal Conductivity |
6 |
W/m.k |
- |
ASTM D5470 |
Flame Rating |
V-0 |
- |
- |
UL 94 |
Insulation Strength |
>10 |
Kv/mm |
- |
ASTM D149 |
Weight Loss |
<1 |
% |
- |
ASTM E595 |
Specific Gravity |
3.09 |
g/cm3 |
± 0.2 |
ASTM D792 |
Working Temperature Range |
-40 ~ +200 |
℃ |
- |
- |
Surface Resistance |
1016 |
Ohm |
- |
ASTM D257 |
Elongation |
60 |
% |
± 13 |
ASTM D412 |
Tensile Strength |
6 |
Kgf/cm2 |
± 2 |
ASTM D412 |
Standard Shape |
- |
Sheet ones |
- |
- |
Hardness |
14 |
Shore A |
± 5 |
ASTM D2240 |
|
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REACH Compliant 