L37-3F Thermal Conductive Pad
Available to apply adhesive,
pre-cut for different shape.
Feature
- Good thermal conductivity
- Easy to assembly
- Good insulator
- Carrier: Fiberglass
Application
- Electronic components:IC、CPU、MOS
- LED、M/B、P/S、HEAT SINK、LCD-TV、N/B PC、PC、Telecom Device、Wireless Hub…etc.
- DDR II Module、DVD Applications、Hand-set applications…etc.
Thermal Impedance V.S Pressure (mouse over)
 |
 |
| Property | L37-3F | Unit | Tolerance | Test |
Color |
Yellow |
- |
- |
Visual |
Thickness
(Gap is 0.1mm, |
0.25 / 0.3 / 0.45 |
mm |
- |
ASTM D374 |
0.0098/0.0118/0.0177 |
Inch |
- |
ASTM D374 |
|
Thermal Conductivity |
1.4 |
W/m.k |
- |
ASTM D5470 |
Flame Rating |
V-0 | - | - | UL 94 |
Insulation Strength |
3 / 4 / 5 |
Kv/mm |
- |
ASTM D149 |
Weight Loss |
<1 |
% |
- |
ASTM E595 |
Specific Gravity |
2.0 |
g/cm³ |
± 0.2 |
ASTM D792 |
Working Temperature Range |
-40 ~ +200 |
℃ |
- |
- |
Surface Resistance |
1013 |
Ohm |
- |
ASTM D257 |
Elongation |
5 |
% |
± 13 |
ASTM D412 |
Tensile Strength |
150 |
Kgf/cm² |
± 2 |
ASTM D412 |
Standard Shape |
- |
Sheet ones |
- |
- |
Hardness |
80 |
Shore A |
± 5 |
ASTM D2240 |
|
||||
REACH Compliant 