Available to apply adhesive,
pre-cut for different shape.
L37-3F Thermal Conductive Pad
Feature
- Good thermal conductivity
- Easy to assemble
- Good insulator
- Carrier : Fiberglass
Application
- Electronic components: IC、CPU、MOS
- LED、M/B、P/S、Heat Sink、LCD-TV、Notebook PC、PC、Telecom Device、Wireless Hub……etc.
- DDR II Module、DVD Applications、Hand-set applications……etc.
Thermal Impedance V.S Pressure (mouse over)
 |
 |
| Property | L37-3F | Unit | Tolerance | Test Method |
Color |
Yellow |
- |
- |
Visual |
Thickness |
0.25/ 0.3 /0.45 |
mm |
- |
ASTM D374 |
0.0098/ 0.0118 / 0.0177 |
inch |
- |
ASTM D374 |
|
Thermal Conductivity |
1.4 |
W/m.k |
- |
ASTM D5470 |
Flame Rating |
V-0 |
- |
- |
UL 94 |
Dielectric Breakdown Voltage |
3 / 4 / 5 |
kV |
_ |
ASTM D149 |
Weight Loss |
<1 |
% |
- |
ASTM E595 |
Specific Gravity |
2.0 |
g/cm³ |
±0.2 |
ASTM D792 |
Working Temperature |
-40 ~ +200 |
℃ |
- |
- |
Volume Resistance |
>10¹³ |
Ohm-cm |
- |
ASTM D257 |
Elongation |
5 |
% |
±13 |
ASTM D412 |
Tensile Strength |
150 |
Kgf/cm² |
±2 |
ASTM D412 |
Standard shape |
- |
Sheet ones |
- |
- |
Hardness |
80 |
Shore A |
±5 |
ASTM D2240 |
|
||||
REACH Compliant