LED Thermal Pad Gap Filler

Available to apply adhesive,
pre-cut for different shape.

Thermal Adhesive Tape Thermal PasteNon-silicone Thermal Pad Thermal Compound Manufacturer

L37-3 Thermal Conductive Pad

Feature

  • Good thermal conductivity
  • Ultra soft and high compressibility
  • Natural tack
  • Easy to assemble
  • Very good insulator

Application

  • Electronic components: IC、CPU、MOS
  • LED、M/B、P/S、Heat Sink、LCD-TV、Notebook PC、PC、Telecom Device、Wireless Hub……etc.
  • DDR II Module、DVD Applications、Hand-set applications……etc.

Thermal Impedance V.S Pressure (mouse over)

Thermal Compound Thermal Interface Material
Property L37-3 Unit Tolerance Test Method

Color

Yellow

-

-

Visual

Reinforcement Carrier

fiberglass mesh

 

 

 

Thickness (the thickness can be ordered)

0.3~20

mm

-

ASTM D374

0.0118~0.787

inch

-

ASTM D374

Thermal Conductivity

1.7

W/m.k

-

ASTM D5470

Flame Rating

V-0

-

-

UL 94

Dielectric Breakdown Voltage

>10

kV/mm

_

ASTM D149

Weight Loss

<1

%

-

ASTM E595

Specific Gravity

2.17

g/cm³

±0.2

ASTM D792

Working Temperature

-40 ~ +200

-

-

Volume Resistance

>1012

Ohm-cm

-

ASTM D257

Elongation

-

%

±0.2

ASTM D412

Tensile Strength

66.4

Kgf/cm²

±5

ASTM D412

Standard shape

-

Sheet ones

-

-

Hardness

5

Shore A

±3

ASTM D2240

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Sitemap Thermal Compound Non-silicone Thermal Pad

Thermal Adhesive Tape
LED Thermal Pad