Hi Power LED Ceramic Core Print Circuit Board
Cautions: After open the package, the LED Core Print Circuit Board should be kept at 30%RH or less。
Ceramic circuit boards are made by Nanotech, and sintered at 1450℃. The circuits on the surface are printed by using the silver, and then make the unleaded nickel and tin coating. That provides the circuits with good thermal conductivity and electric conductivity.
Feature
- Highly hot and cold impact resisted (Adapted to any changeable condition)
- Low thermal expansion coefficient (Fit f or the thermal expansion coefficient of LED chip)
- AntiUV
- Chemical erosive resisted which can ensure the durability, reliability, security and stability of LED
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CP-20 |
CP-23 |
CP-57 |
CP-250 |
CP-20 (Functional Characteristics) |
|
Insulation Resistance |
＞10GΩ(1000VDC,1mimute) |
Dielectric Withstanding Voltage |
PASS (1500VAC, 60HZ,1mimute) |
Thermal Conductivity coefficient |
≧8W/mK |
Solder Heat Resistance |
300℃ / 5 Ses |
Electrode tensile strength |
WB 20N (2 KGf ) 以上 |
Density |
≧3. 20 g/cm3 |
porosity |
≦15 % |
ROHS Inspect |
PASS 符合六大有害物質 |
Bending Strength |
WB 100N (10KGf ) 以上 |
Dimensions |
Φ20mm(+/-2.0mm)*T 2.0mm(max) |
CP-23 (Functional Characteristics) |
|
Insulation Resistance |
＞10GΩ(1000VDC,1mimute) |
Dielectric Withstanding Voltage |
PASS (1500VAC, 60HZ,1mimute) |
Thermal Conductivity coefficient |
≧5 w/mk |
Solder Heat Resistance |
300℃ / 5 Ses |
Electrode tensile strength |
WB 20N (2 KGf ) 以上 |
Density |
≧2.50 g/cm3 |
porosity |
≦10 % |
ROHS Inspect |
PASS 符合六大有害物質 |
Bending Strength |
WB 100N (10KGf ) 以上 |
Dimensions |
Φ23mm(+/-2.0mm)*T 2.0mm(max) |
CP-57 (Functional Characteristics) |
|
Insulation Resistance |
＞10GΩ(1000VDC,1mimute) |
Dielectric Withstanding Voltage |
PASS (1500VAC, 60HZ,1mimute) |
Thermal Conductivity coefficient |
≧10W/mK |
Solder Heat Resistance |
300℃ / 5 Ses |
Electrode tensile strength |
WB 20N (2 KGf ) 以上 |
Density |
≧2.50 g/cm3 |
porosity |
≦1.50 % |
ROHS Inspect |
PASS 符合六大有害物質 |
Bending Strength |
WB 100N (10KGf ) 以上 |
Dimensions |
Φ53mm(+/-3.0mm)*T 2.0mm(max) |
CP-250 (Functional Characteristics) |
|
Insulation Resistance |
＞10GΩ(1000VDC,1mimute) |
Dielectric Withstanding Voltage |
PASS (1500VAC, 60HZ,1mimute) |
Thermal Conductivity coefficient |
≧3W/mK |
Solder Heat Resistance |
300℃ / 5 Ses |
Electrode tensile strength |
WB 10N (1 KGf ) 以上 |
Density |
≧2.0 g/cm3 |
porosity |
≦40.0 % |
ROHS Inspect |
PASS 符合六大有害物質 |
Bending Strength |
WB 300N (3KGf ) 以上 |
Dimensions |
L250mm(+/-10mm)*W20mm(+/3mm)*T 2.0mm(max) |
