Gap Filler

pre-cut for different shape.

MCPCBThermal Pad

Li-2000 Thermal Tape

Feature

  • Good adhesion (Silicone PSA)
  • Low contact thermal impedance
  • High thermal conductivity
  • High bond strength
  • High temp. – Long term stability
  • Electrical insulating

Application

  • Electronic components: IC、CPU、MOS
  • LED、M/B、P/S、Heat Sink、LCD-TV、Notebook PC、PC、Telecom Device、Wireless Hub……etc.
  • DDR II Module、DVD Applications、Hand-set applications……etc.

 

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Thermal Paste
Property Li-2000 Test Method UNIT

Color

White

white

Visual

-

Reinforcement Carrier

Fiberglass

Fiberglass

-

-

Thickness

0.15

0.25

ASTM D374

mm

Continuous Working Temperature

-45~170

-45~170

-

Short time Use Temperature(30 sec)

288

288

-

Initial Tack

10

10

PSTC-6

cm

Lap Shear Strength.

74

76

D1002

N/cm2

Die Shear Strength@25℃

113

126

-

N/cm2

Die Shear Strength@80℃

80

85

-

N/cm2

Die Shear Strength@150℃

80

85

-

N/cm2

Holding Power 1000g@25℃using 1 in2

>40000

>40000

PSTC-7

min

Holding Power 1000g@80℃using 1 in2

>40000

>40000

PSTC-7

min

Holding Power 1000g@150℃using 1 in2

>10000

>10000

PSTC-7

min

Tensile Strength

6

6

ASTM D412

N/mm2

Dielectric Breakdown Voltage (Vac)

>2

>3

ASTM D149

kV

Dielectric Breakdown Voltage (Vdc)

>3

>4

ASTM D149

kV

Volume Resistance

>1011

>1011

ASTM D257

Ohm-cm

Thermal Conductivity

1.2

1.2

ASTM D5470

W/m*K

Thermal Impedance @<1psi

0.90

1.40

ASTM D5470

℃in2/W

Thermal Impedance @10psi

0.81

1.30

ASTM D5470

℃in2/W

Thermal Impedance @30psi

0.76

1.16

ASTM D5470

℃in2/W

Thermal Impedance @50psi

0.73

0.90

ASTM D5470

℃in2/W

Thermal Impedance @70psi

0.68

0.86

ASTM D5470

℃in2/W

Thermal Impedance @100psi

0.54

0.80

ASTM D5470

℃in2/W

Flame rating

V-1

V-1

UL94

-

Thermal Compound ManufacturerREACH Compliant Thermal Paste ManufacturerRoHS Compliant

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