Thermal Compound MCPCB

pre-cut for different shape.

Ceramic Heat Spreader LED Thermal PadThermal Paste Thermal Paste Manufacturer

Li-2000A Thermal Tape

Feature

  • Good adhesion (Silicone PSA)
  • Low contact thermal impedance
  • High thermal conductivity
  • High bond strength
  • High temp. – Long term stability
  • Electrical insulating

Application

  • Electronic components: IC、CPU、MOS
  • LED、M/B、P/S、Heat Sink、LCD-TV、Notebook PC、PC、Telecom Device、Wireless Hub……etc.
  • DDR II Module、DVD Applications、Hand-set applications……etc.

 

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Gap Filler Non-silicone Thermal Pad
Property Li-2000A Unit Test Method

Color

white

-

Visual

Reinforcement Carrier

-

-

-

Thickness

0.2

mm

ASTM D374

Continuous Working Temperature

-45~170

-

Short time Use Temperature(30 sec)

260

-

Initial Tack

>30

cm

PSTC-6

Lap Shear Strength.

35

N/cm2

D1002

Die Shear Strength@25℃

60

N/cm2

-

Die Shear Strength@80℃

50

N/cm2

-

Die Shear Strength@150℃

40

N/cm2

-

Holding Power 1000g@25℃using 1 in2

>40000

min

PSTC-7

Holding Power 1000g@80℃using 1 in2

>40000

min

PSTC-7

Holding Power 1000g@150℃using 1 in2

>10000

min

PSTC-7

Dielectric Breakdown Voltage (Vac)

>3.5

kV

ASTM D149

Dielectric Breakdown Voltage (Vdc)

>4.5

kV

ASTM D149

Volume Resistance

>1011

Ohm-cm

ASTM D257

Thermal Conductivity

2.0

W/m*K

ASTM D5470

Thermal Impedance @<1psi

0.70

℃in2/W

ASTM D5470

Thermal Impedance @10psi

0.63

℃in2/W

ASTM D5470

Thermal Impedance @30psi

0.54

℃in2/W

ASTM D5470

Thermal Impedance @50psi

0.45

℃in2/W

ASTM D5470

Thermal Impedance @70psi

0.40

℃in2/W

ASTM D5470

Thermal Impedance @100psi

0.35

℃in2/W

ASTM D5470

Flame rating

V-0

-

UL94

Thermal Interface Material Thermal PadREACH Compliant Thermal PasteRoHS Compliant

Sitemap Thermal Compound Non-silicone Thermal Pad

LED Thermal Pad