pre-cut for different shape.
PC93 Non-Silicone Thermal Conductive Pad
Feature
- Low contact thermal impedance
- Good thermal conductivity
- Silicone free
- Long term stability
Application
- Electronic components: IC、CPU、MOS
- LED、M/B、P/S、Heat Sink、LCD-TV、Notebook PC、PC、Telecom Device、Wireless Hub……etc.
- DDR II Module、DVD Applications、Hand-set applications……etc.
Thermal Impedance V.S Pressure (mouse over)
 |
 |
| Property | PC93 | Unit | Tolerance | Test Method |
Color |
Gray |
- |
- |
Visual |
Thickness (the thickness can be ordered) |
0.25~5.0 |
mm |
- |
ASTM D374 |
0.0098~0.1969 |
inch |
- |
ASTM D374 |
|
Thermal Conductivity |
2 |
W/m.k |
- |
ASTM D5470 |
Flame rating |
V-0 |
- |
- |
UL94 |
Dielectric Breakdown Voltage |
10 |
kV/mm |
- |
ASTM D149 |
Weight Loss |
<1 |
% |
- |
ASTM E595 |
Specific Gravity |
1.5 |
g/cm³ |
±0.2 |
ASTMD 792 |
Working Temperature |
-40~+105 |
℃ |
- |
- |
Volume Resistance |
>1012 |
Ohm-cm |
- |
ASTMD 257 |
Elongation |
350 |
% |
±13 |
ASTMD 412 |
Tensile Strength |
1 |
Kgf/mm² |
±2 |
ASTMD 412 |
Standard shape |
Sheet ones |
- |
- |
- |
Hardness |
40 |
Shore 00 |
±5 |
ASTMD 2240 |
|
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REACH Compliant