PC93 Non-Silicone Thermal Conductive Pad
Available to apply adhesive,
pre-cut for different shape.
Feature
- Low contact thermal impedance
- Good thermal conductivity
- Silicone free
- Long term stability
Application
- Electronic components:IC、CPU、MOS
- LED、M/B、P/S、HEAT SINK、LCD-TV、N/B PC、PC、Telecom Device、Wireless Hub…etc.
- DDR II Module、DVD Applications、Hand-set applications…etc.
Thermal Impedance V.S Pressure (mouse over)
 |
 |
| Property | PC93 | Unit | Tolerance | Test |
Color |
Gray |
- |
- |
Visual |
Thickness
(Gap is 0.1mm, |
0.25~5.0 |
mm |
- |
ASTM D374 |
0.0098~0.1969 |
inch |
- |
ASTM D374 |
|
Thermal Conductivity |
2 |
W/m.k |
- |
ASTM D5470 |
Flame Rating |
V-0 |
- |
- |
UL94 |
Insulation Strength |
10 |
Kv/mm |
|
ASTM D149 |
Weight Loss |
<1 |
% |
- |
ASTM E595 |
Specific Gravity |
1.5 |
g/cm³ |
±0.2 |
ASTM D792 |
Working Temperature Range |
-30~150 |
℃ |
- |
- |
Surface Resistance |
1010 |
Ohm |
- |
ASTM D257 |
Elongation |
350 |
% |
±13 |
ASTM D412 |
Tensile Strength |
30 | Kgf/mm² |
±2 |
ASTM D412 |
Standard Shape |
Sheet ones |
- | - | - |
Hardness |
60 |
Shore 00 |
±5 |
ASTMD 2240 |
|
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REACH Compliant 