Thermal Interface Material

Ceramic Heat SpreaderNon-silicone Thermal Pad

PH3 Heat Spreader

Feature

  • Component junction temperature reduction of 20℃is typical. Easily added to existing designs to lowest component temperatures, improve reliability.

  • Pre-cut for different shape.

Application

  • Electronic components: IC、CPU、MOS
  • LED、M/B、P/S、Heat Sink、LCD-TV、Notebook PC、PC、Telecom Device、Wireless Hub……etc.
  • DDR II Module、DVD Applications、Hand-set applications……etc.

 

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Thermal Adhesive Tape
Property PH3 Unit

Color

Black

-

Thickness

0.21

mm

Thermal Conductor

Copper

-

Thermal conductor thickness

0.1

mm

Insulator

Polyester

-

Insulator thickness

0.05

mm

Pressure-sensitive adhesive (PSA) system

 Acrylic PSA

-

PSA thickness

0.05

mm

Dielectric Breakdown Voltage

1.5

kV

Specific Gravity

7.5

g/cm³

Thermal CompoundREACH Compliant Thermal Interface MaterialRoHS Compliant

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