PH3 Heat Spreader
Available to apply adhesive,
pre-cut for different shape.
Feature
Component junction temperature reduction of 20℃is typical. Easily added to existing designs to lowest component temperatures, improve reliability. Pre-cut for different shape.
Application
- Electronic components:IC、CPU、MOS
- LED、M/B、P/S、HEAT SINK、LCD-TV、N/B PC、PC、Telecom Device、Wireless Hub…etc.
- DDR II Module、DVD Applications、Hand-set applications…etc.
(mouse over)
 |
| Property | PH3 | Unit |
Color |
Black |
- |
Thickness |
0.21 |
mm |
Thermal Conductor |
Copper |
- |
Thermal conductor thickness |
0.1 |
mm |
Insulator |
Polyeaster |
- |
Insulator thickness |
0.05 |
mm |
Pressure-sensitive adhesive (PSA) system |
Polyester film |
- |
PSA thickness |
0.05 |
mm |
Dielectric strength |
3.5 |
kv |
Specific Gravity |
7.5 |
g/cm³ |
