Thermal Compound Manufacturer

Storage: S606 has a shelf-life of eighteen (18) months from the date of manufacture, as indicatedby the lot numbet, when stored in the original, unopened contained at or below 25℃.

Thermal CompoundGap Filler

S606 Thermal Grease

Feature

  • Good thermal conductivity
  • Easy to assemble
  • High stability
  • Would not harden

Application

  • Electronic components: IC、CPU、MOS
  • LED、M/B、P/S、Heat Sink、LCD-TV、Notebook PC、PC、Telecom Device、Wireless Hub……etc.
  • DDR II Module、DVD Applications、Hand-set applications……etc.

 

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Thermal Paste Manufacturer
Property S606 S606B S606C Unit Test Method

Color

White白

White白

Gray 灰

-

Visual

Thermal Conductivity

3.6

1.8

5

W/m.k

ASTM D5470

Weight Loss

<0.5

<0.5

<0.5

%

ASTM E595

Specific Gravity

2.3

2.3

2.3

g/cm³

ASTMD 792

Working Temperature

-40 ~ +180

-40 ~ +180

-40 ~ +180

-

Volume Resistance

1012

1012

1012

Ohm-cm

ASTM D257

Standard Package

1kg

1kg

1kg

Kg / pot

-

Ceramic Heat SpreaderREACH Compliant Thermal Interface MaterialRoHS Compliant

Sitemap Thermal Compound Non-silicone Thermal Pad

Non-silicone Thermal Pad Thermal Compound Thermal Interface Material