TG-6050 Ultra Soft Thermal Conductive Pad
Available to apply adhesive,
pre-cut for different shape.
Feature
- Very good thermal conductivity
- Compliancy、high compressibility
- Low hardness (shore 00)
- Low oil bleed. Long term stability
- Electrical insulating
Application
- Electronic components:IC、CPU、MOS
- LED、M/B、P/S、HEAT SINK、LCD-TV、N/B PC、PC、Telecom Device、Wireless Hub…etc.
- DDR II Module、DVD Applications、Hand-set applications…etc.
Thermal Impedance V.S Pressure (mouse over)
 |
 |
| Property | TG-X | Unit | Tolerance | Test |
Color |
Gray |
- |
- |
Visual |
Thickness (Gap is 0.1mm, |
0.5~5.0 |
mm |
- |
ASTM D374 |
0.1969~0.1969 |
inch |
- |
ASTM D374 |
|
Thermal Conductivity |
12 |
W/m.k |
- |
ASTM D5470 |
Flame Rating |
V-0 |
- |
|
UL 94 |
Insulation Strength |
12 |
Kv/mm |
- |
ASTM D149 |
Weight Loss |
<1 |
% |
- |
ASTM E595 |
Specific Gravity |
3.4 |
g/cm³ |
± 0.2 |
ASTM D792 |
Working Temperature |
-45 ~ +200 |
℃ |
- |
- |
Volume Resistance |
1010 |
Ohm |
- |
ASTM D257 |
Standard shape |
- |
Sheet ones |
- |
- |
Hardness |
60 |
Shore 00 |
± 5 |
ASTM D2240 |
|
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REACH Compliant 