Ceramic Heat Spreader

pre-cut for different shape.

Thermal PadNon-silicone Thermal Pad

TG-X Ultra Soft Thermal Conductive Pad

Feature

  • Very good thermal conductivity
  • Compliancy、high compressibility 70%
  • Natural tack
  • Low hardness (shore 00)
  • Low oil bleed. Long term stability
  • Electrical insulating

Application

  • Electronic components: IC、CPU、MOS
  • LED、M/B、P/S、Heat Sink、LCD-TV、Notebook PC、PC、Telecom Device、Wireless Hub……etc.
  • DDR II Module、DVD Applications、Hand-set applications……etc.

Thermal Impedance V.S Pressure (mouse over)

Thermal Adhesive Tape Thermal Paste Manufacturer
Property TG-X Unit Tolerance Test Method

Color

Gray

-

-

Visual

Thickness

0.5 /2.0

mm

-

ASTM D374

0.0197~0.0787

inch

-

ASTM D374

Thermal Conductivity

12

W/m.k

-

ASTM D5470

Flame Rating

V-0

-

-

UL 94

Dielectric Breakdown Voltage

12

kV/mm

-

ASTM D149

Weight Loss

<1

%

-

ASTM E595

Specific Gravity

3.4

g/cm³

±0.2

ASTM D792

Working Temperature

-45 ~ +200

-

-

Volume Resistance

>1011

Ohm-cm

-

ASTM D257

Standard shape

-

Sheet ones

-

-

Hardness

60

Shore 00

±5

ASTM D2240

Gap FillerREACH Compliant MCPCBRoHS Compliant

Sitemap Thermal Compound Non-silicone Thermal Pad

Thermal Paste Manufacturer Thermal Compound
Thermal Pad Thermal Interface Material