Non-silicone Thermal Pad Thermal Compound Thermal Interface Material

pre-cut for different shape.

Ceramic Heat Spreader Thermal Adhesive Tape LED Thermal PadMCPCB Gap Filler Thermal Paste

TG-6050 Ultra Soft Thermal Conductive Pad

Feature

  • Very good thermal conductivity
  • Compliancy、high compressibility 70%
  • Natural tack
  • Low hardness (shore 00)
  • Low oil bleed. Long term stability
  • Electrical insulating

Application

  • Electronic components: IC、CPU、MOS
  • LED、M/B、P/S、Heat Sink、LCD-TV、Notebook PC、PC、Telecom Device、Wireless Hub……etc.
  • DDR II Module、DVD Applications、Hand-set applications……etc.

Thermal Impedance V.S Pressure (mouse over)

Thermal Compound Manufacturer Thermal Pad Thermal Paste Manufacturer LED Thermal Pad
Property TG6050 Unit Tolerance Test Method

Color

Red

-

-

Visual

Thickness

0.5~5.0

mm

-

ASTM D374

0.0197~0.1969

inch

-

ASTM D374

Thermal Conductivity

6

W/m.k

-

ASTM D5470

Flame Rating

V-0

-

-

UL 94

Dielectric Breakdown Voltage

13

kV/mm

-

ASTM D149

Weight Loss

<1

%

-

ASTM E595

Specific Gravity

3.2

g/cm³

±0.2

ASTM D792

Working Temperature

-45 ~ +200

-

-

Volume Resistance

>10¹²

Ohm-cm

-

ASTM D257

Elongation

50

%

±13

ASTM D412

Tensile Strength

0.5

Kgf/cm²

±2

ASTM D412

Standard shape

-

Sheet ones

-

-

Hardness

50

Shore 00

±5

ASTM D2240

Thermal Compound ManufacturerREACH Compliant Thermal Interface MaterialRoHS Compliant

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