X889 Thermal Composite Material
Available to apply adhesive,
pre-cut for different shape.
Feature
- Good heat spreader
- Good thermal conductivity
- Easy to assemble
- High stability
Application
- Electronic components:IC、CPU、MOS
- LED、M/B、P/S、HEAT SINK、LCD-TV、N/B PC、PC、Telecom Device、Wireless Hub…etc.
- DDR II Module、DVD Applications、Hand-set applications…etc.
(mouse over)
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| Property | X889 | X889-1 | Unit | Test |
| (3 Layers) Thermal Silicone+ Graphite+ Thermal Silicone |
(3 Layers) Thermal Silicone+ AI+ Thermal Silicone |
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Color |
Gary |
Gary |
- |
Visual |
Thickness |
0.25~0.6 |
0.13 |
mm |
ASTM D374 |
0.0098~0.0236 |
0.051 |
inch |
ASTM D374 |
|
Thermal Conductivity |
X,Y, 400 |
Z,4 |
W/m.k |
ASTM E1530 |
Z, 5 |
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Flammability Level |
V-0 |
V-0 |
- |
UL94 |
Insulation Strength |
>1 |
>2 |
KV |
ASTM D149 |
Weight Loss |
<1 |
<1 |
% |
ASTM E595 |
Specific Gravity |
1.85 |
1.85 |
g/cm3 |
ASTM D792 |
Working Temperature Range |
-40~+200 |
-40~+200 |
℃ |
- |
Surface Resistance |
2.2x10¹² |
2.2x10¹² |
Ohm |
ASTM D257 |
|
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REACH Compliant 