pre-cut for different shape.
X889 Thermal Composite Material
Feature
- Good heat spreader
- Good thermal conductivity
- Easy to assemble
- High stability
Application
- Electronic components: IC、CPU、MOS
- LED、M/B、P/S、Heat Sink、LCD-TV、Notebook PC、PC、Telecom Device、Wireless Hub……etc.
- DDR II Module、DVD Applications、Hand-set applications……etc.
(mouse over)
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| Property | X889 | X889-1 | Unit | Test Method |
| (3 Layers) Thermal Silicone+ Graphite+ Thermal Silicone |
(3 Layers) Thermal Silicone+ AI+ Thermal Silicone |
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Color |
Gray |
Gray |
- |
Visual |
Thickness |
0.25~0.6 |
0.13 |
mm |
ASTMD 374 |
0.098~0.0236 |
0.051 |
inch |
ASTMD 374 |
|
Thermal Conductivity |
X,Y, 400 |
Z,4 |
W/m.k |
ASTME 1530 |
Z,5 |
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Flame rating |
V-0 |
V-0 |
- |
UL94 |
Dielectric Breakdown Voltage |
>1 |
>2 |
KV |
ASTMD 149 |
Weight Loss |
<1 |
<1 |
% |
ASTM E595 |
Specific Gravity |
1.85 |
1.85 |
g/cm³ |
ASTMD 792 |
Working Temperature |
-40 ~ +200 |
-40 ~ +200 |
℃ |
- |
Volume Resistance |
2.2x10¹² |
2.2x10¹² |
Ohm-cm |
ASTMD 257 |
|
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REACH Compliant