Thermal Pad

Available to apply adhesive,
pre-cut for different shape.

Non-silicone Thermal PadThermal Adhesive Tape

XL-25 Ceramic Heat Spreader

Feature

  • Big air-contact area, good heat spreader
  • Low weight
  • High Voltage Breakdown / High Resistance
  • Easy to assemble
  • The special shape can be ordered

Application

  • Power Transisto、 Power Module、CPU、Chip IC、PC Board

Thermal Impedance V.S Pressure (mouse over)

Thermal Paste Manufacturer

Property

XL-25

Unit

Test

 Color

Gray

-

Visual

Thickness and Size

See table

-

-

Thermal Conductivity

6.79

w/m.k

-

Insulation Strength

>500

Voltage

ASTMD 149

Specific Gravity 

1.89

g/cm3

CNS 619

Surface Resistance

>109

Ohm

ASTMD 257

Flexural Strength

47.5

Kgf/cm2

CNS 12701

Porosity

30

%

CNS 619

Working temperature

<500

-

Linear Thermal Expansion Coefficient

4.13

10-6

RT~300℃

Main Composition

SiC / Al2O3 / SiO2

 

-

Hardness

5~6

Moh`s

DIN En101-1992

Size:

10*10*2

20*20*2

30*30*2

40*40*2

40*40*3凸

50*50*3凸

Sitemap Thermal Compound Non-silicone Thermal Pad

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